The DW0108GS275 is a flexible PCB connector designed for high-performance electronic applications. Featuring a 2.54 mm pitch, it accommodates 0.025 square inch wire size with insulation materials comprising black glass-filled polyester for DW, EW, ZW series, and natural liquid crystal polymer for HW series. Constructed with phosphor bronze contact material, plated in gold or tin, it operates within -55°C to +125°C temperatures, with RoHS compliance and lead-free solderability. Its adjustable height options and robust design ensure reliable signal transmission in demanding environments, suitable for stacking and board mounting requiring precise alignment and durability.
Operating Temperature Range: -55°C to +125°C (with Gold), -55°C to +105°C (with Tin)
RoHS Compliance: Yes
Solderability: Lead-Free, Wave Solder Only
Series: DW, EW, ZW, HW with various height options
Physical Dimensions: Length varies with model, typical 19.46 mm to 21.08 mm
Application: Stacking connectors, board to board connections, high-performance electronics
Additional: Mechanical stability recommended with spacers, non-standard series, non-returnable
Buy the Samtec Series DW: PCB Connector: DW0108GS275
Order the Samtec DW0108GS275 flexible PCB connector online today to ensure seamless integration in your electronic projects. This high-performance connector features a 2.54 mm pitch, RoHS compliance, and robust materials suitable for demanding environments. Designed with precise insulator and terminal materials, it offers excellent temperature range, reliable solderability, and customizable height options for versatile applications. Get fast shipping and expert support when you buy online to enhance your device reliability with this durable, high-quality connector.
Buy Samtec DW0108GS275 now and experience unmatched reliability and performance in high-quality electronic connections.
Frequently Asked Questions
Where can I buy SAMTEC DW0108GS275?
You can click on the BUY or RFQ button to purchase DW0108GS275 from an authorized SAMTEC distributor.
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