The product is a flexible circuit connector designed for high-density applications, featuring a compact size with a 2.54 mm pitch. It includes black glass-filled polyester insulators and phosphor bronze terminals plated with gold or tin, ensuring excellent electrical conductivity and corrosion resistance. Operating temperature ranges from -55°C to +125°C with gold plating. This connector is RoHS compliant and suitable for precise signal and power connections in demanding industrial environments. Its durable construction and specific dimensional profile make it ideal for stacking and board-to-board applications in electronics manufacturing.
Insulator Material: Black Glass-Filled Polyester for ZW/ DW, Natural Liquid Crystal Polymer for HW
Terminal Material: Phosphor Bronze
Plating: Gold or Tin over Nickel
Operating Temp Range: -55°C to +125°C with Gold, -55°C to +105°C with Tin
RoHS Compliant: Yes
Material: Copper alloy with gold or tin plating
Dimensions: Pitch 2.54 mm (0.100 inch), length varies with model, typical length approximately 19.46 mm to 21.08 mm
Contact Resistance: Low contact resistance for reliable connections
Applications: Board stacking, high-density signal, and power transfer in industrial electronics
Additional Features: Suitable for mechanical stability with spacers, non-standard, non-returnable
Buy the Samtec DW0911LD620 – Reliable Stacking Connector for Industrial Applications
Order the Samtec DW0911LD620 stacking connector online today to ensure fast delivery and exceptional quality. Designed for industrial electronics, this connector offers high-density connections with gold or tin plating for corrosion resistance. Its compact size and precise dimensions make it ideal for mounting in tight spaces and demanding environments. Whether for board stacking or signal transfer, this connector provides durability, reliability, and excellent electrical performance. Purchase now to optimize your electronic assembly with a trusted industry-standard component.
Buy Samtec DW0911LD620 now and experience unmatched reliability and performance in high-density electronic connections.
Frequently Asked Questions
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