The DW1011LD400 connector is a versatile, high-performance stacking and board-to-board connector designed for reliable electrical connections in various electronic applications. It features a flexible 0.025 sq in/mm² insulator material suitable for high temperatures, with gold or tin plating for enhanced durability. Operating within -55°C to +125°C, this RoHS-compliant component supports critical engineering projects demanding robustness, excellent electrical conductivity, and precise pin alignment. Its compact design makes it ideal for space-constrained environments, ensuring easy integration with a variety of circuit boards and electronic assemblies.
Plating: Gold or Sn over Ni (50 micro inches) for durability
Operating Temp Range: -55°C to +125°C with Gold, -55°C to +105°C with Tin
RoHS Compliant: Yes
Solderability: Lead-Free Solderable
Number of Pins: Varies by model, includes options for longer tail versions
Dimensions: Length varies, typical tail length approximately 2.29 mm (~0.090 inches), typical spacing 2.54 mm (~0.100 inches)
Buy the Buy Samtec Connector Part Number DW1011LD400 Online
Purchase the Samtec Board Stacker Connector DW1011LD400 online today for reliable high-performance connections suitable for a broad range of electronic applications. Featuring gold or tin plating, this connector supports RoHS compliance and operates efficiently within -55°C to +125°C, ensuring durability and stability. Its compact design makes it ideal for space-constrained environments and high-density circuits. With easy installation and versatile configurations, this connector guarantees optimal electrical conductivity, mechanical stability, and long-term performance, making it a strategic choice for engineers and electronic designers alike.
Order your Samtec Series DW1011LD400 connector today and ensure dependable electrical connections with high-temperature stability and space-saving design.
Frequently Asked Questions
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You can click on the BUY or RFQ button to purchase DW1011LD400 from an authorized SAMTEC distributor.
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