The DW-11-20-T-D-825 connector is a versatile and high-performance board stacker designed for seamless interconnection in electronic assemblies. It features a durable insulator material, phosphor bronze terminal contacts with gold or tin plating, and an operating temperature range from -55°C to +125°C. Its RoHS compliance ensures environmentally friendly manufacturing. The connector's compact size and reliable design make it suitable for high-density applications, offering excellent electrical performance, mechanical stability, and easy installation for complex electronic systems. Ideal for use in industrial, automation, and control equipment.
Insulator Material: Black Glass Filled Polyester for ZW and DW, Natural Liquid Crystal Polymer for HW
Terminal Material: Phosphor Bronze
Plating: Gold or Tin over Nickel
Operating Temp Range: -55°C to +125°C with Gold, -55°C to +105°C with Tin
RoHS Compliant: Yes
Solderability: Lead-Free Solderable
Dimensions: Length varies with model, typical length around 19.46 mm to 21.08 mm
Pin Options: 8 to 100 pins available
Style: Stackers for high-density board-to-board connections
Certification: RoHS compliant, suitable for environmentally friendly manufacturing
Application: Industrial equipment, automation systems, electronic interconnects, control panels
Buy the Buy Samtec Stacker Connectors Part Number DW1112GD740 Online
Discover the versatility and high reliability of the Samtec Stacker Connectors, ideal for industrial automation and electronic systems. Easy to install with durable materials, these connectors support RoHS compliance and operate within a temperature range of -55°C to +125°C. Their compact design accommodates high pin counts, making them perfect for space-constrained environments. With gold or tin plating options, they ensure excellent electrical performance and corrosion resistance. Purchase online today to enhance your electronic assemblies with top-quality interconnect solutions from Samtec.
Buy Samtec DW1112GD740 connector now and experience unmatched reliability and performance in high-density electronic interconnections.
Frequently Asked Questions
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