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SAMTEC DW2009ST375 High-Density Interconnect

This product is a flexible interconnect component designed for high-density electrical and signal connections. Made with robust materials like black glass filled polyester and natural liquid crystal polymer, it offers excellent thermal stability from -55°C to +125°C, compliant with RoHS standards. The component features gold or tin over phosphor bronze plating, ensuring reliable electrical contact. Suitable for board stacking applications, it provides a versatile solution with multiple options for heights and configurations, optimizing space and performance in electronic assemblies.

Authorized Distributors
Source:DigiKey
Part No:DW-20-09-S-T-375
Stock:74
Inv Date:06-09-2026
Price: Unit price: $92.54
Buy/RFQ:
Source:DigiKey
Part No:DW-20-09-S-T-375
Stock:0
Inv Date:06-09-2026
Price: Unit price: $10.8
Buy/RFQ:
Part No:DW-20-09-S-T-375
Stock:0
Inv Date:06-10-2026
Price: Unit price: $12.03
Buy/RFQ:
Part No:DW-20-09-S-T-375
Stock:0
Inv Date:06-09-2026
Price: Unit price: $12.09
Buy/RFQ:
Part No:DW-20-09-S-T-375
Stock:74
Inv Date:06-09-2026
Price: Unit price: $12.04
Buy/RFQ:

SAMTEC DW2009ST375 High-Density Interconnect Specifications:

  • Insulator Material: Black Glass Filled Polyester or Natural Liquid Crystal Polymer
  • Terminal Material: Phosphor Bronze with Gold or Tin Plating
  • Operating Temp Range: -55°C to +125°C with Gold, -55°C to +105°C with Tin
  • RoHS Compliant: Yes
  • Solderable: Yes, RoHS compliant
  • Plating Thickness: 50 µin (1.27 µm) gold over nickel
  • Physical Dimensions: Length varies depending on configuration, typical height options available
  • Additional Options: Mechanical stability enhancements with board spacers recommended
  • Designations: Compatible with multiple styles and configurations, see Samtec for details
  • Notes: Non-standard, non-returnable; consult Samtec for specific requirements and configurations

Buy the Samtec Series DW2009ST375 Interconnect: DW2009ST375

Enhance your electronic assemblies with the high-density interconnect designed by Samtec. Featuring durable gold or tin plating, it operates efficiently across a temperature range of -55°C to +125°C, ensuring stability and longevity. Its versatile configuration options include various heights and configurations tailored for board stacking and high-density applications. Made with RoHS-compliant, high-quality materials, this interconnect ensures excellent electrical contact and mechanical stability. Order online now to secure fast delivery and elevate your electronic system performance.

Order your Samtec Series DW2009ST375 high-density interconnect today and ensure reliable, high-performance connectivity for your electronic projects.

Frequently Asked Questions

Where can I buy SAMTEC DW2009ST375?

You can click on the BUY or RFQ button to purchase DW2009ST375 from an authorized SAMTEC distributor.

How do I troubleshoot issues or seek technical support for part DW2009ST375?

You can download the DW2009ST375 datasheet or visit the SAMTEC website for support.

Who is the manufacturer of DW2009ST375?

SAMTEC

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