The product is a flexible, high-quality board stacking connector designed for reliable electrical and mechanical performance in electronic assemblies. Made with durable insulator materials like black glass-filled polyester and crystal polymer, it features phosphor bronze contacts plated with gold or tin for superior conductivity and corrosion resistance. Operating within -55°C to +125°C, this connector supports RoHS compliance and lead-free soldering. Ideal for compact, high-density applications requiring secure stacking, it offers various height and pin configurations. The DW2612TS746LL ensures dependability, easy installation, and compliance with industry standards for electronic interconnects.
Insulator Material: Black Glass-Filled Polyester, Crystal Polymer
Terminal Material: Phosphor Bronze
Plating: Gold or Tin over Nickel
Operating Temperature Range: -55°C to +125°C with Gold, -55°C to +105°C with Tin
RoHS Compliant: Yes
Solderability: Lead-Free
Support for high-density stacking connections with customizable height and pin options
Dimensions vary depending on model, typical contact length 1.009 inches, height options up to 0.530 inches
Cable mates available in different styles and sizes for versatile applications
Connector supports RoHS and comprehensive industry standards
Buy the Buy Samtec Board Stacker Part Number DW2612TS746LL Online
Enhance your electronic assemblies with the durable and high-performance board stacking connector. Featuring gold or tin-plated contacts and a temperature range up to 125°C, this connector ensures reliable electrical connections. Its flexible design, RoHS compliance, and various height options make it perfect for compact, high-density projects. Easily install these connectors for secure stacking and improved device performance. Purchase your Samtec DW2612TS746LL online today to benefit from trusted quality and industry-leading innovation in electronic interconnect solutions.
Order your Samtec Series DW2612TS746LL board stacking connector today and enhance your electronic projects with reliable high-density interconnects.
Frequently Asked Questions
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