This high-density board stacking connector series offers excellent coplanarity and reliable solderability with options for gold or tin plating, making it suitable for SMT applications. Designed for vertical stacking, it supports high pin counts with precise pin spacing and mechanical stability features. The connectors are RoHS compliant, lead-free, and available in various heights. They are ideal for space-constrained environments requiring durable, high-performance interconnects with optional through-hole or surface-mount configurations, ensuring dependable electrical connections in complex electronic assemblies.
Insulator Material: Likely thermoplastic, suitable for high-density mounting
Terminal Material: Phosphor Bronze
Plating: Au or Sn over 50 µ" (1.27 µm) Ni
Operating Temperature Range: -55°C to +105°C with Tin, -55°C to +125°C with Gold
RoHS Compliant: Yes
Lead-Free Solderable: Yes
Number of Pins: Varies per configuration, up to 50 pins or more
Pin Spacing: 0.15 mm (max) for coplanarity
Stack Height Options: Multiple, with details available on datasheet
Mounting Style: Surface-mount (SMT) or through-hole, via configuration
Mechanical Stability: Recommended use of mechanical spacers in gold-plated versions
Contact Arrangement: Accepts multi-row configurations, suited for high-density applications
Buy the Buy Samtec DWM1057LS373 Part Number DWM1057LS373 Online
Secure your high-density stacker connectors online today. Designed for excellent coplanarity, RoHS compliance, and optional gold or tin plating, these connectors are perfect for space-constrained, high-performance electronic systems. Ideal for SMT or through-hole assembly, they provide durable electrical connections with precise pin spacing and multiple height options. Enhance your production efficiency and ensure reliable connections in complex boards by ordering these premium, RoHS-compliant connectors directly from trusted online distributors now.
Order your Samtec DWM1057LS373 stacker connector today and enhance your electronic assemblies with reliable, high-density interconnect solutions.
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