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SAMTEC DWM1059GD300 Micro Board Stacker Connector
The SAMTEC DWM series micro board stacker connectors are engineered for demanding high-density applications requiring robust board stacking solutions. These connectors utilize LCP (Liquid Crystal Polymer) for the insulator material, providing excellent electrical and mechanical properties. The terminal material is phosphor bronze, plated with either gold or tin over nickel to ensure reliable connectivity. The DWM series is suitable for 'skyscraper' board stacking and is available in both surface mount and through-hole configurations, offering flexibility in design. For optimal mechanical stability, Samtec recommends using mechanical board spacers, especially with gold-plated connectors. This series is non-standard and non-returnable.
SAMTEC DWM1059GD300 Micro Board Stacker Connector Specifications:
- Insulator Material: LCP
- Mates with: SMS, SLM, RSM
- Terminal Material: Phosphor Bronze
- Plating: Au or Sn over 50 µ" (1.27 µm) Ni
- Operating Temp Range (Tin): -55 °C to +105 °C
- Operating Temp Range (Gold): -55 °C to +125 °C
- Lead-Free Solderable: Yes
- SMT Lead Coplanarity: (0.15 mm) .006" max
- RoHS Compliant: Yes
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Frequently Asked Questions
Where can I buy SAMTEC DWM1059GD300?
You can click on the BUY or RFQ button to purchase DWM1059GD300 from an authorized SAMTEC distributor.
How do I troubleshoot issues or seek technical support for part DWM1059GD300?
You can download the DWM1059GD300 datasheet or visit the SAMTEC website for support.
Who is the manufacturer of DWM1059GD300?
SAMTEC