The DWM1159SS415 is a high-density surface-mount board stacking connector designed for robust electronic applications requiring precise co-planarity and reliable connections. Crafted with phosphor bronze terminal material and plated with Au or Sn over Ni, this connector supports operating temperatures from -55°C to +125°C with gold plating and up to +105°C with tin. It features a 0.15 mm (0.006 inch) max coplanarity, RoHS compliance, and is ideal for high-density SMT applications, providing excellent mechanical stability for complex electronic assemblies.
Plating: Au over Ni or Sn over Ni (50 μ'' or 1.27 μm)
Operating Temperature Range: -55°C to +125°C with Gold, -55°C to +105°C with Tin
RoHS Compliant: Yes
Lead-Free Solderable: Yes
Coplanarity: Max 0.15 mm (0.006 inch)
Number of Pins: Not specified
Surface Mount: Yes
Mechanical Stability: Supports high-density SMT applications, recommended use of board spacers
Certifications: RoHS
Buy the Samtec Series DWM: High-Density Board Stacking Connector: DWM1159SS415
Experience reliable high-density stacking with the Samtec DWM1159SS415 connector. Designed for SMT applications, it offers excellent co-planarity, RoHS compliance, and operates across a wide temperature range. Ideal for complex electronic assemblies requiring mechanical stability and precise connections. Featuring gold and tin plating options, this connector ensures durability and corrosion resistance. Its compact design supports advanced manufacturing with high pin counts, making it indispensable for demanding electronic systems. Purchase online today for trusted quality and performance in your projects.
Get Samtec DWM1159SS415 today—built for high-density electronic stacking and long-lasting durability.
Frequently Asked Questions
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You can click on the BUY or RFQ button to purchase DWM1159SS415 from an authorized SAMTEC distributor.
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