This high-density stacking connector series features gold or tin plating, designed for SMT applications with coplanarity and through-hole compatibility. Made with phosphor bronze, these connectors operate within -55°C to +125°C and are RoHS compliant. They are ideal for stacking multiple boards in complex electronic assemblies, offering excellent mechanical stability, high reliability, and precise alignment. Suitable for various industrial, automation, and electronic applications requiring compact, low-profile connectors with customizable heights and configurations.
Insulator Material: Not specified, see manufacturer datasheet
Terminal Material: Phosphor Bronze
Plating: Au over Ni (50 μ
Dimensions: Length varies with option, typical tail length approximately 4.0 mm
RoHS Compliance: Yes
Operating Temperature Range: -55°C to +125°C with Gold, -55°C to +105°C with Tin
Lead-Free Solderable: Yes
RoHS Compliant: Yes
Surface Mount Technology (SMT): Yes
Coplanarity: Max 0.15 mm
Mechanical Stability: Recommended use of mechanical spacers for gold plated versions
Certifications: See manufacturer datasheet for complete certifications
Notes: Non-standard, non-returnable; specifications subject to change without notice; customer requirements must be approved by Samtec
Buy the Samtec DWM1356GS350 Reliable Board Stacker Connectors for Industrial Applications
Enhance your electronic assemblies with this high-density stacking connector series, featuring gold or tin plating, phosphor bronze terminals, and RoHS compliance. Designed for SMT applications, these connectors ensure excellent mechanical stability, coplanarity, and precise alignment, making them ideal for complex industrial and automation systems. With customizable heights and configurations, they provide reliable, space-saving solutions for multi-board stacking. Purchase online today to improve your manufacturing efficiency and ensure dependable connectivity in your critical electronic projects.
Buy Samtec DWM1356GS350 now and experience unmatched reliability and performance in high-density electronic stacking solutions.
Frequently Asked Questions
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