This high-density stacker connector series is designed for SMT applications, offering excellent coplanarity and mechanical stability. Made from phosphor bronze with gold or tin plating, it supports operating temperatures from -55°C to +125°C. The connectors are RoHS compliant, lead-free, and ideal for through-hole or surface-mount configurations. Suitable for board stacking in complex electronics assemblies, providing reliable electrical contact with precise pin spacing and optional mechanical spacers for added stability. Compatible with advanced circuit board designs requiring high-density interconnections.
Insulator Material: Likely LCP or similar high-performance plastic
Terminal Material: Phosphor Bronze
Plating: Au or Sn over 50 µ
Operating Temp Range: -55°C to +125°C
RoHS Compliant: Yes
Lead-Free Solderable: Yes
Suitable for high-density SMT applications, through-hole stacking, and surface-mount configurations
Mechanical stability enhanced with optional spacers
Pin spacing and positions vary with model, supporting complex PCB layouts
Dimensions and pin counts vary for different series options
Supports RoHS directive, ensuring compliance with environmental standards
Connector height options available for different applications
Designed for high-density interconnections in modern electronics manufacturing
Buy the Buy Samtec DWM2001SS208 Part Number DWM2001SS208 Online
Purchase the high-density stacker connector online from Samtec and enhance your electronic designs with premium interconnect solutions. These connectors support SMT applications and PCB stacking, offering excellent coplanarity and mechanical stability with optional spacers for added durability. Made from phosphor bronze with gold or tin plating, they operate from -55°C to +125°C and meet RoHS standards. Whether for through-hole or surface-mount configurations, these connectors ensure reliable electrical contact, supporting complex, high-density circuit layouts for demanding industry applications.
Buy Samtec DWM2001SS208 now and experience unmatched reliability and performance in high-density electronic assemblies.
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