The DWM2301TS230 is a high-density, board-to-board stacking connector designed for vertical applications with excellent coplanarity and RoHS compliance. It features a phosphor bronze terminal material with gold or tin over nickel plating, operating in temperatures from -55°C to +125°C, depending on plating. Suitable for SMT mounting, it supports fine pitch, high pin counts, and provides mechanical stability with optional spacers. Ideal for compact electronic assemblies requiring reliable, space-efficient interconnections in demanding industrial environments.
Operating Temp Range: -55 °C to +125 °C with Gold, -55 °C to +105 °C with Tin
RoHS Compliant: Yes
Lead-Free Solderable: Yes
Max Coplanarity: 0.15 mm
Pitch: 0.50 mm
Number of pins, height options, and configurations vary; consult datasheet for details
Suitable for SMT applications and high-density board stacking
Mechanical stability enhanced with optional spacers
Buy the Samtec Series DWM High-Density Board Stacker: DWM2301TS230
Purchase the Samtec DWM2301TS230 board stacking connector online today. This high-density, RoHS-compliant connector ensures reliable and space-efficient interconnections with gold or tin plating options. Designed for SMT applications, it supports fine pitch, high pin counts, and offers excellent mechanical stability through optional spacers. Perfect for compact electronic devices and industrial equipment, this connector provides robust electrical performance in demanding environments, ensuring your electronic assemblies are both precise and durable for long-term operation.
Get Samtec DWM2301TS230 today—built for precision, high-density connections, and long-lasting durability.
Frequently Asked Questions
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You can click on the BUY or RFQ button to purchase DWM2301TS230 from an authorized SAMTEC distributor.
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