The DWM2557GD230 is a high-density, stackable board-to-board connector designed for SMT applications, featuring gold over nickel plating for excellent conductivity and corrosion resistance. It supports operating temperatures from -55°C to +125°C with gold plating, making it ideal for demanding electronic assemblies requiring reliable performance. The connector offers coplanarity and mechanical stability, suitable for both through-hole and surface mount configurations. Its compact design and precise pin alignment optimize space utilization in complex electronic systems, ensuring durability and consistent electrical contact in high-density environments.
Plating: Au over Ni (50 μ" / 1.27 μm) for gold, Tin for others
Operating Temp Range: -55°C to +125°C with Gold plating
RoHS Compliant: Yes
Lead-Free Solderable: Yes
Number of Pins: Not specified
Dimensions: Compact stackable design, exact dimensions vary by configuration
Application: High-density PCB connections, through-hole and surface mount
Mounting Type: SMT and through-hole compatibility
Mechanical Stability: Includes recommendations for spacers in gold plated variants
Certifications: RoHS compliant, detailed recognition info available on Samtec website
Buy the Buy Samtec DWM2557GD230 Part Number DWM2557GD230 Online
Purchase the Samtec Stackable Board Connector DWM2557GD230 online today for high-density electronic assemblies requiring precise alignment, enhanced durability, and excellent conductivity. Designed with gold over nickel plating for optimal performance across operating temperatures from -55°C to +125°C, this connector suits both SMT and through-hole mounting configurations. Its compact design maximizes space efficiency while providing robust mechanical stability, ideal for complex systems. Order now and benefit from quick delivery and trusted quality that ensures long-lasting, reliable connections in your electronic projects.
Get Samtec DWM2557GD230 today—engineered for high-density PCB stacking and reliable electrical contact in demanding electronic applications.
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