The DWM3054GS319 is a high-density board stacker designed for surface-mount technology (SMT) applications. It features a phosphor bronze terminal with gold or tin over nickel plating, suitable for environments with operating temperatures from -55°C to +125°C. This stacker is RoHS compliant, lead-free, and ideal for vertical stacking in compact electronic assemblies. Its design supports precise coplanarity, mechanical stability, and easy installation, making it suitable for advanced electronic packaging solutions that require reliable, high-density interconnections.
Material: Phosphor Bronze terminal with Au or Sn over 50 µ" Ni plating
Operating Temp Range: -55°C to +125°C (with Gold), -55°C to +105°C (with Tin)
RoHS Compliant: Yes
Lead-Free Solderable: Yes
Suitable for high-density SMT applications
Supports multiple pin configurations and heights
Designed for mechanical stability and coplanarity
Assembly Type: Surface Mount Technology (SMT)
Connector Length: Varies depending on configuration
Pin Material: Phosphor Bronze with Gold or Tin over Nickel
Application: Board stacking, signal transmission, electronic modules
Certifications: RoHS compliant, additional specifications available on samtec.com
Buy the Samtec Series DWM: High-Density Board Stacker DWM3054GS319
Get the Samtec DWM3054GS319 board stacker online and upgrade your electronic projects with a high-quality, reliable stacking connector. Designed for SMT, it offers exceptional mechanical stability and precise coplanarity, supporting high-density configurations for advanced electronic assemblies. RoHS compliant and lead-free, it’s suitable for a wide temperature range from -55°C to +125°C with gold plating, ensuring durability and corrosion resistance. Order now for fast delivery and superior performance in your electronic manufacturing needs.
Order your Samtec Series DWM3054GS319 high-density board stacker today and enhance your electronic assembly with reliable, compact interconnect solutions.
Frequently Asked Questions
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