The DWM3055GS200 is a high-density, surface-mount board stacking connector featuring gold or tin plating options, designed for reliable electrical connections in SMT applications. It allows for compact stacking with a 0.15 mm coplanarity and is RoHS compliant. Suitable for through-hole and surface-mount designs, this connector offers excellent mechanical stability, easy installation, and broad temperature operation from -55°C to +125°C with gold plating. Ideal for electronic assemblies requiring precise alignment and high-density interconnectivity, it supports various pin configurations and board spacings for versatile use.
Mechanical Stability: Enhanced by recommended spacers, suitable for high-frequency applications
Certifications: RoHS Compliant
Design: Supports high-density SMT and through-hole stacking with coplanarity 0.15 mm
Application: Ideal for electronic modules requiring precise stacking and reliable electrical connections
Buy the Samtec Series HDWM DWM3055GS200: High-Density Board Stacking Connector
Secure your electronic projects with the Samtec Series HDWM DWM3055GS200 high-density stacking connector, designed for SMT and through-hole assemblies. Featuring gold or tin plating options, this connector ensures excellent electrical conductivity and corrosion resistance. Its compact design supports high pin counts and precise coplanarity, making it suitable for demanding applications. Buy online today and enjoy fast delivery, competitive pricing, and proven reliability in your electronic components, elevating your manufacturing quality and ensuring long-lasting performance.
Order your Samtec Series HDWM DWM3055GS200 today and ensure your electronic assemblies achieve dependable, high-density connectivity with enhanced mechanical stability.
Frequently Asked Questions
Where can I buy SAMTEC DWM3055GS200?
You can click on the BUY or RFQ button to purchase DWM3055GS200 from an authorized SAMTEC distributor.
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