The DWM3261GD810 is a high-density, RoHS-compliant board stacking connector featuring gold-over-nickel plating and phosphor bronze terminals. Designed for SMT applications, it offers excellent coplanarity and mechanical stability, suitable for through-hole or surface-mount stacking. The connector operates within a temperature range of -55°C to +125°C, ensuring reliable performance across various environments. Its compact design enables efficient use of space in high-density electronic assemblies, making it ideal for advanced electronics requiring dense component placement and secure connections.
Plating: Au over Ni (50 μ" or 1.27 μm), Tin optional
RoHS Compliant: Yes
Operating Temp Range: -55°C to +125°C (with Gold, or -55°C to +105°C with Tin)
Lead-Free Solderable: Yes
Suitable for high-density SMT applications
Dimensions vary with configuration and number of pins; typical pitch 0.50 mm
Surface Mount Technology (SMT) compatible
Mechanical stability enhanced with optional board spacers
Designed for through-hole or surface mounting
Co-planarity: 0.15 mm maximum
Buy the Samtec Series DWM: High-Density Stack Connector DWM3261GD810
Enhance your electronic assemblies with the high-density, RoHS-compliant DWM3261GD810 connector from Samtec. Featuring gold-over-nickel plating and phosphor bronze terminals, this connector provides superior electrical performance and mechanical stability. Its compact design supports high-density PCB configurations for space-saving solutions. Designed for SMT applications, it ensures excellent coplanarity and durability across temperature ranges. Purchase online today to enjoy quick delivery, reliable quality, and a solution that meets demanding electronic industry standards for performance and environmental compliance.
Order your Samtec Series DWM3261GD810 today and ensure reliable high-density board stacking with secure, RoHS-compliant connections.
Frequently Asked Questions
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You can click on the BUY or RFQ button to purchase DWM3261GD810 from an authorized SAMTEC distributor.
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