The DWM5001SS235 is a compact and high-density board stacking connector series designed for reliable SMT applications. Featuring Au or Sn over Ni plating, operating temperature ranges from -55°C to +125°C, and RoHS compliance, this connector ensures durability and environmental safety. It supports through-hole board stacking, offers multiple height options, and is suitable for applications requiring precise coplanarity and mechanical stability. Ideal for high-density electronic assemblies, the DWM5001SS235 enhances connectivity solutions in advanced manufacturing and electronic system integration.
Operating Temp Range: -55°C to +125°C with Gold, -55°C to +105°C with Tin
RoHS Compliance: Yes
Lead-Free Solderable: Yes
Application: High-density SMT and through-board stacking
Supports multiple heights
Connector pitch: 0.15 mm (0.006 inch) max coplanarity
Surface Mount Technology (SMT)
Mechanical stability aided by board spacers
Certifications: RoHS compliant
Buy the Samtec Series HDWM High-Density Stack: DWM5001SS235
Purchase the Samtec DWM5001SS235 high-density board stacking connector online for reliable SMT assembly. Designed for durability, it features gold or tin over Ni plating, supports temperature ranges from -55°C to +125°C, and is RoHS compliant. Ideal for electronic systems requiring precise coplanarity and mechanical stability, this connector supports multiple height options and ensures excellent connectivity in compact, high-density designs. Buy now for superior performance in your manufacturing process.
Get Samtec DWM5001SS235 today—built for high-density electronic assembly and reliable board stacking solutions.
Frequently Asked Questions
Where can I buy SAMTEC DWM5001SS235?
You can click on the BUY or RFQ button to purchase DWM5001SS235 from an authorized SAMTEC distributor.
How do I troubleshoot issues or seek technical support for part DWM5001SS235?