The product is a flexible board stacking connector designed for reliable electrical connections in electronic devices. Made with black glass-filled polyester insulation and phosphor bronze terminal material, it offers robust durability and excellent contact performance. Operating temperature ranges from -55°C to +125°C with gold plating and -55°C to +105°C with tin, ensuring consistent performance in various environments. The connector supports RoHS compliance and lead-free soldering. Its dimensions accommodate 2.54 mm pitch, with options for longer tails and multiple pin counts, making it suitable for high-density stacking applications in complex electronic assemblies.
Operating Temperature Range: -55°C to +125°C with Gold, -55°C to +105°C with Tin
RoHS Compliant: Yes
Lead-Free Solderable: Yes
Pitch: 2.54 mm (.100 inch)
Dimensions: Length varies with number of pins, tail length approximately 1.009 inches (25.65 mm)
Contact Material: Phosphor Bronze
Certifications: RoHS compliant
Mechanical stability: Mechanical board spacers recommended in gold plated applications
Series: ZW, HW, DW, EW
Connector Type: Board stacking connector
Number of Pins: Varies, up to 52 pins
Additional features: Non-standard, non-returnable, suitable for high-density stacking applications
Buy the Buy Samtec Stacking Connector Part Number EW2813TS570 Online
Order the Samtec board stacking connector EW2813TS570 online today and enhance your electronic assembly with a highly reliable, RoHS compliant connection solution. Designed with high-quality materials including phosphor bronze terminals and black glass-filled polyester insulation, it ensures durability and excellent electrical contact in demanding environments. With a pitch of 2.54 mm and options for longer tails, this connector supports dense PCB layouts. Its gold or tin plating guarantees excellent conductivity and corrosion resistance. Perfect for industrial, automation, and electronics applications requiring dependable stacking connections.
Buy Samtec EW2813TS570 now and experience unmatched reliability and high-density stack performance for electronic devices.
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