The HMTSW10422GD125 is a high-density, wafer-style connector with a 2.54 mm pitch designed for versatile stacking applications. Constructed from black glass-filled polyester insulators and phosphor bronze contacts, it features 50 micro-inch Ni plating for reliable conduction. Operating from -55°C to +125°C with gold plating, this connector supports a wide temperature range. Its compact, stackable design offers flexible configurations for electronic assemblies, making it suitable for board-to-board or cable-to-board connections in demanding industrial and electronics projects.
Plating: 50 micro-inch Ni with optional Gold or Tin
Operating Temperature Range: -55°C to +125°C with Gold, -55°C to +105°C with Tin
Dimensions: Compact design with various post heights, support for multiple stack configurations
Pitch: 2.54 mm (0.100 inch)
RoHS Compliant: Yes
Lead-Free Solderable: Yes
Certification: RoHS Compliant
Post Styles: Straight and Right-Angle options available for flexible mounting
Buy the Buy Samtec MTSW Series Connector Part Number HMTSW10422GD125 Online
Purchase the Samtec HMTSW series high-density wafer connector online to enhance your electronic projects with reliable board-to-board and cable-to-board connections. Designed for versatile stacking configurations with flexible post heights, it features durable phosphor bronze contacts with Ni and optional gold or tin plating to ensure excellent electrical performance and corrosion resistance. Operating efficiently in temperature ranges from -55°C to +125°C, this connector complies with RoHS standards. Secure your industrial, automation, or instrumentation applications with a trusted, high-quality connector now.
Order your Samtec Series HMTSW high-density wafer connector today and give your electronic assemblies the reliable, flexible connection quality they deserve.
Frequently Asked Questions
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