The HMTSW10509TD310 is a versatile high-density board-to-board connector offering flexible stacking options for electronic assemblies. It features a black glass-filled polyester insulator with gold or tin plating options, ensuring reliable electrical contact and corrosion resistance. Designed for quick and secure mating, this connector supports various post heights, up to 1.000 inches, facilitating customized configurations. Suitable for applications requiring robust, space-efficient connections in complex electronic systems, the HMTSW10509TD310 meets industry standards for performance and reliability, making it ideal for advanced manufacturing and tech integration.
Plating: 50 micro inches (1.27 micrometers) Gold or Tin
Operating Temp Range: -55 °C to +125 °C with Gold, -55 °C to +105 °C with Tin
RoHS Compliant: Yes
Post Height: Specify in inches, increments of 0.005" (0.13 mm), up to 1.000 inches
Dimensions: OAL varies with configuration, typical post height options
Contact Material: Phosphor Bronze with Gold/Tin plating
Electrical Contact Resistance: Low resistance for reliable connectivity
Application: PCB-to-Board connections in electronic assemblies
Buy the Samtec Series HMTSW High-Density Board-to-Board Connector: HMTSW10509TD310
Purchase the Samtec HMTSW10509TD310 online today and enhance your electronic assembly with a reliable, space-efficient, and customizable connector solution. This high-density board-to-board connector features gold and tin plating, supporting a wide temperature range for varied applications. Its flexible post height options allow precise configuration to fit your design needs. Enjoy rapid delivery and trusted quality from Samtec, optimized for demanding technological environments where secure, long-lasting electrical contact is critical for your project's success.
Buy Samtec HMTSW10509TD310 now and experience unmatched reliability and performance in your electronic connections.
Frequently Asked Questions
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