The HMTSW-108-09-T-S-350 series offers high-density, stackable board-to-board connectors designed for flexible configurations with pitch sizes of 2.54 mm (.100 inch) and 1.27 mm (.050 inch). Made from black glass-filled polyester insulators and phosphor bronze contacts with gold and tin plating, these connectors operate within -55°C to +125°C, providing excellent durability for demanding applications. Suitable for electronic systems requiring secure, modular connections, these connectors are RoHS compliant and customizable in height, offering versatile stacking options for compact electronics and instrumentation setups.
Terminal Material: Phosphor Bronze with Gold (50 µin) on Post, Tin Plated
Operating Temperature Range: -55°C to +125°C with Gold, -55°C to +105°C with Tin
RoHS Compliant: Yes
Post Height: Specify in INCHES (.005" (0.13 mm) increments)
Pitch Sizes: 2.54 mm (.100 inch), 1.27 mm (.050 inch)
Lead-Free Solderable: Yes
Contact Plating: Gold and Tin options available
Series: MTSW - Modular stackable connectors with customizable configurations
Application: Electronic systems requiring reliable, modular interconnects, PCB connections, and instrumentation setups
Dimensions: Length varies with configuration, typical height adjustable in .005 inch increments, suitable for high-density electronics applications
Buy the Samtec Series MTSW Board Connectors: HMTSW10809TS350
Shop the Samtec HMTSW10809TS350 modular board connectors online today for reliable, stackable interconnect solutions. Designed for high-density electronic systems, these connectors feature customizable heights, gold and tin plating, and broad temperature tolerance. Perfect for compact PCB layouts, instrumentation, and modular electronics, they ensure secure connections and long-term durability. Experience seamless assembly and versatile configurations with Samtec's innovative series. Purchase now to enhance your electronic design with high-quality, RoHS-compliant connectors that maintain performance in demanding environments.
Get Samtec HMTSW10809TS350 today—built for precision, modular stacking, and long-lasting durability in high-density electronic applications.
Frequently Asked Questions
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