The HMTSW10908GS250 is a high-quality, versatile stacking connector designed for compact electronic applications. Crafted with durable black glass-filled polyester insulator material and phosphor bronze with nickel plating, it ensures reliable performance across a wide temperature range of -55°C to +125°C with gold and -55°C to +105°C with tin plating. Featuring various length options, it offers excellent flexibility in stacking height and post configurations. Compatible with RoHS standards and suitable for wave soldering, this connector provides robust electrical contact and precise alignment, ideal for electronic and industrial use.
Terminal Material: Phosphor Bronze with Nickel Plating
Plating: Gold on post, Tin options available
Operating Temperature Range: -55°C to +125°C with Gold, -55°C to +105°C with Tin
RoHS Compliant: Yes
Dimensions vary with length options, post heights in 0.005-inch (0.13 mm) increments, typical length approximately 0.90 inches (22.86 mm)
Application: High-density stacking connectors for electronic devices
Compatible with wave soldering processes
Lead-Free Solderable: Yes
Configuration: Straight and Right-Angle versions available
Certification: RoHS compliant
Design: Non-standard, non-returnable series, subject to change without notice
Buy the Buy Samtec HMTSW10908GS250 Part Number HMTSW10908GS250 Online
Order the Samtec HMTSW10908GS250 stacking connector online today and enjoy fast delivery of a durable, versatile component suitable for compact electronic assemblies. Its high-quality construction with phosphor bronze contacts and gold or tin plating ensures excellent electrical performance and corrosion resistance. Compatible with wave soldering and RoHS standards, this connector offers flexible configurations, including straight and right-angle options, with various post heights for customized stacking solutions. Invest in reliable connectivity for your electronic projects now.
Buy Samtec HMTSW10908GS250 now and experience unmatched reliability and performance in stacking connectors for high-density electronic applications.
Frequently Asked Questions
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