The HMTSW13609GD315 is a high-density, stackable board-to-board connector designed for reliable electrical connections in complex electronic systems. It features a black glass-filled polyester insulator, phosphor bronze contact material with gold plating, and operates within a temperature range of -55°C to +125°C with gold coating. Suitable for industrial applications, this connector provides flexible stacking options with customizable post heights and pitch options, ensuring robust performance for diverse interconnect needs in electronics manufacturing and automation systems. Its RoHS compliance ensures environmental safety and quality standards.
Operating Temperature Range: -55°C to +125°C with Gold, -55°C to +105°C with Tin
RoHS Compliant: Yes
Post Height: Customizable, specified in inches
Pitch: 2.54 mm (0.100 inch), 2.29 mm, 2.54 mm, 2.8 mm, 3.0 mm, 3.46 mm, 4.0 mm, 4.5 mm, 5.33 mm, 6.08 mm, 7.82 mm, 8.54 mm, 9.8 mm, 11.30 mm, 12.19 mm, 13.46 mm, 18.54 mm, 21.08 mm, 28.16 mm, 39.37 mm
Connector Style: Straight and Right Angle options available
Number of Positions: Configurable, up to 50 positions
Certifications: RoHS Compliant
Compatibility: Designed for PCB mounting in electronic assemblies
Design: Modular stacking with customizable post heights for flexible configurations
Buy the Samtec HMTSW13609GD315 – Reliable Stackable Board Connector for Industrial Applications
Enhance your electronic projects with the reliable and customizable Stackable Board Connector. Featuring gold-plated contacts, flexible stacking options, and a robust design, this connector ensures secure, long-lasting connections for complex industrial and automation applications. Easy to assemble and compatible with various PCB configurations, it offers optimal performance in demanding environments. Purchase online today and improve your device’s reliability and efficiency with this high-quality, RoHS-compliant interconnect solution designed for versatile industrial use.
Buy Samtec HMTSW13609GD315 now and experience unmatched reliability and performance in complex electronic interconnect systems.
Frequently Asked Questions
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