This high-quality stacking connector features natural and black LCP insulators, phosphor bronze terminals with gold or tin plating, and RoHS compliance. Designed for PCB applications, it supports operating temperatures from -55°C to +105°C and offers SMT solderability and coplanarity of 0.006 inches. Suitable for board-mating connections, it includes features like lockable options and mechanical stability enhancements. The connector's modular design ensures reliable electrical contact with up to 10 positions per row, making it ideal for compact electronic assemblies requiring robust, customizable interconnects.
Insulator Material: Natural LCP (top), Black LCP (bottom)
Terminal Material: Phosphor Bronze
Plating: Au or Sn over 50 µ
Operating Temperature Range: -55°C to +105°C
RoHS Compliant: Yes
Lead-Free Solderable: Yes
SMT Lead Coplanarity: 0.006 inches (0.15 mm)
Number of Pins per Row: 10
Stack No.: 1
Pin Spacing: 2.54 mm (.100 inch)
Max Stacker Height: specific options available
Locking Clip: manual placement available for enhanced stability
Mechanical stability via board spacers recommended for gold or selective gold plating
Connector supports various optional platings and configurations based on application needs
Design accommodates modular stacking with robust electrical contact and reliable performance
Buy the Buy Samtec HW1020GD827SM Part Number HW1020GD827SM Online
Purchase the Samtec stacking connector HW1020GD827SM online today for exceptional reliability in PCB interconnections. Featuring natural and black LCP insulators, phosphor bronze terminals with gold or tin plating, and RoHS compliance, this connector supports operating temperatures from -55°C to +105°C. It offers SMT solderability, coplanarity of 0.006 inches, and modular stacking options, making it ideal for compact, high-performance electronics. Order now to ensure your projects benefit from durable, adaptable interconnect solutions for demanding industrial or consumer applications.
Get Samtec HW1020GD827SM today—designed for high reliability and mechanical stability in electronic assemblies.
Frequently Asked Questions
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