The MTLW Series low-profile board mates feature a black liquid crystal polymer insulator and gold over nickel plating for enhanced conductivity and corrosion resistance. Designed for high-quality electrical connections, these modular connectors support 1 to 40 pins with options for lead-free soldering, RoHS compliance, and various heights to accommodate IDC assemblies. Widely used in electronic devices, their robust construction ensures reliable performance in a range of temperatures from -55°C to +125°C. Suitable for applications requiring compact design with secure, durable connections.
Terminal Material: Copper alloy with gold over nickel plating
Plating: Gold over nickel for corrosion resistance and conductivity
Number of Positions: 1 to 40 pins, with optional omitted pins
Lead Plating: Au or Sn over nickel, RoHS compliant
Temperature Range: -55°C to +125°C in some configurations, -55°C to +105°C in others
Current Rating: Up to 2 pins powered, specific values vary
Dimensions: Supports standard or modified post heights, applications include low-profile and IDC assemblies
RoHS Compliance: Yes, lead-free solderable
Material: Black Liquid Crystal Polymer insulator for durability and electrical insulation
Application: Electrical and electronic device assembly requiring reliable, compact connectors
Buy the Buy Samtec Low-Profile Board Mates Part Number MTLW10122GD435 Online
Enhance your electronic assemblies with the high-quality Low-Profile Board Mates featuring gold-plated contacts for superior conductivity and corrosion resistance. Designed with a black liquid crystal polymer insulator, these connectors support 1 to 40 pins and come with RoHS compliance and lead-free soldering options. Suitable for applications from -55°C to +125°C, their robust construction ensures durability and reliable performance. Ideal for space-constrained projects, these connectors provide secure connections for electronic devices and systems, ensuring longevity and stability.
Buy Samtec MTLW10122GD435 now and experience unmatched reliability and performance in compact electronic connections.
Frequently Asked Questions
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