The MTLW series features low-profile board mates and cable mates designed for high-quality, reliable connections in compact electronic assemblies. Made with black liquid crystal polymer insulators and 50 microinch gold over nickel plating, these connectors support RoHS compliance and broad temperature ranges from -55°C to +125°C. They accommodate IDC assemblies and other applications, offering options with different lead styles, plating, and heights. Ideal for electronics requiring space-efficient solutions, these series ensure durable, solderable, and RoHS-compliant connections in demanding environments.
Plating: Gold over Nickel, 50 microinch (1.27 micrometers)
Temperature Rating: -55°C to +125°C (Gold plated), -55°C to +105°C (Tin plated)
Current Rating: Based on pin count and configuration, consult datasheet
RoHS Compliant: Yes
Lead-Free Solderable: Yes
Number of Pins: Options up to 40 positions
Lead Style: Standard and modified for IDC assemblies
Dimensions: No. of positions varies; standard pitch 2.54 mm (0.100 inches)
Material: Phosphor Copper and Bronze terminals
Buy the Samtec Series TLW MTLW: MTLW11605GS190
Order the Samtec MTLW11605GS190 low-profile connector online today to ensure a reliable, space-efficient connection solution for your electronic devices. Designed with durable materials, gold plating, and RoHS compliance, this connector supports high-temperature ranges from -55°C to +125°C and offers customizable options for different applications. Perfect for tight spaces, it features easy solderability and broad pin count options. Secure your high-quality connection with quick online purchasing, ensuring your assembly remains robust, compliant, and easy to integrate in demanding environments.
Buy Samtec MTLW11605GS190 low-profile connectors now and experience unmatched reliability and performance for your electronic assembly needs.
Frequently Asked Questions
Where can I buy SAMTEC MTLW11605GS190?
You can click on the BUY or RFQ button to purchase MTLW11605GS190 from an authorized SAMTEC distributor.
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