The MTMM series is a high-quality, modified through-hole header designed for reliable board-to-board connections in various electronic assemblies. Made from black liquid crystal polymer insulator material and phosphor bronze terminals plated with gold over nickel, these headers offer excellent electrical performance and thermal stability. Compatible with RoHS standards and lead-free soldering, they support operating temperatures from -55°C to +125°C depending on plating. Available in multiple configurations, MTMM headers are ideal for applications requiring durable, high-current connections in compact spaces, with options for single, double, or quad-row arrangements.
Operating Temp Range: -55°C to +125°C (with Gold plating), -55°C to +105°C (with Tin plating)
RoHS Compliant: Yes
Lead-Free Solderable: Yes
Pitch: 2.00 mm (0.0787 inch)
Number of Positions: Custom options available, including 9 to 13 positions
Height Options: Ranges from approximately 6.48 mm to 21.08 mm depending on configuration
Dimensions vary based on configuration, with detailed sizes available for different series
Design: Modified through-hole header, suitable for multiple board-mate arrangements
Buy the Buy Samtec Through-Hole Header Part Number MTMM10304GD164 Online
Order the Samtec through-hole header MTMM10304GD164 online today to ensure your electronic assemblies benefit from superior connection quality, durability, and temperature resilience. Designed with high-grade materials like liquid crystal polymer insulators and gold-plated phosphor bronze terminals, these headers provide excellent electrical conductivity and are RoHS compliant for environmentally responsible manufacturing. Suitable for a range of configurations, they are ideal for applications demanding reliable, long-lasting, high-current connections in tight spaces. Purchase now to streamline your assembly process and enhance product performance.
Buy Samtec MTMM10304GD164 now and experience unmatched reliability and performance in board-to-board connections, suitable for compact, high-density electronic assemblies.
Frequently Asked Questions
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