The MTMM series are modified through-hole headers designed for reliable board-to-board connections in industrial applications. These headers feature a choice of single, double, or quad rows with a 2.00 mm pitch, incorporating high-quality phosphor bronze contacts with gold or tin plating for enhanced electrical conductivity and corrosion resistance. Made from liquid crystal polymer insulator material, they support operating temperatures from -55°C to +125°C, comply with RoHS standards, and are lead-free and solderable. These customizable headers are ideal for demanding electronic assemblies requiring secure, durable connections.
Terminal Material: Phosphor Bronze, 0.13 mm thickness
Plating: Sn or Au over 50 µ
Ni
Operating Temperature Range: -55°C to +125°C
RoHS Compliant: Yes
Lead-Free: Yes
Solderable: Yes
Termination Style: Through-Hole
Contact Resistance: Not specified
Number of Positions: Customizable (example shown 10 to 13 positions)
Design: Non-standard, non-returnable series
Certifications: RoHS compliant
Operating Temperature: -55°C to +125°C
Buy the Samtec MTMM10402GD006 – Reliable Board-to-Board Connectors for Industrial Applications
Order the Samtec modified through-hole headers today to ensure secure and durable connections in your industrial electronics. Featuring a 2.00 mm pitch, high-quality phosphor bronze contacts, and RoHS compliance, these headers are solderable and operate efficiently within -55°C to +125°C. Customize the number of positions to fit your project requirements. Built according to Samtec’s strict specifications, these headers provide reliable electrical performance, corrosion resistance, and ease of assembly. Perfect for demanding industrial environments requiring high-quality interconnects.
Buy Samtec MTMM10402GD006 now and experience unmatched reliability and performance in your industrial electronic assemblies.
Frequently Asked Questions
Where can I buy SAMTEC MTMM10402GD006?
You can click on the BUY or RFQ button to purchase MTMM10402GD006 from an authorized SAMTEC distributor.
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