The MTMM series are modified through-hole headers designed for reliable board connections. Made from black liquid crystal polymer insulator material with phosphor bronze terminals, these headers feature tin or gold plating over nickel. Operating temperature ranges from -55°C to +105°C with tin and up to +125°C with gold plating, ensuring durability across various environments. Fully RoHS compliant and lead-free, the headers support high-density configurations with pitch options of 2.00 mm and 3.94 mm. Ideal for engineers seeking high-quality, customizable mating solutions for complex electronic assemblies.
Operating Temperature Range: -55°C to +105°C with Tin, -55°C to +125°C with Gold
RoHS Compliant: Yes
Lead-Free Solderable: Yes
Pitch Options: 2.00 mm (0.0787 inches), 3.94 mm (0.155 inches)
Number of Positions: Configurable with customer specifications
Physical Dimensions: Varies by model, with height options from approximately 6.48 mm to 21.08 mm
Certifications: RoHS compliant
Design: Modified through-hole header with customizable configurations
Note: Series is non-standard and non-returnable
Application: Suitable for high-density electronic assemblies requiring reliable, customizable connections
Buy the Samtec Series MTMM Modified Through-Hole Header: MTMM10412GD465
Order the Samtec MTMM10412GD465 modified through-hole header online today to ensure your electronic projects benefit from high-quality, customizable, RoHS-compliant connections. Designed with durable phosphor bronze terminals and available in standard configurations, this header ensures dependable board-to-board connections in various environments. Featuring optional gold or tin plating over nickel, the MTMM series supports high-temperature applications and is lead-free and solderable. Quick and easy to purchase online, this header provides reliable performance for complex electronic and industrial applications, streamlining your assembly process and enhancing product longevity.
Buy Samtec MTMM10412GD465 now and experience unmatched reliability and high-density performance for your electronic assemblies.
Frequently Asked Questions
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