The MTMM series is a modified through-hole header designed for reliable board-to-board connections in various applications. Made with black liquid crystal polymer insulation and phosphor bronze contacts, it features gold or tin plating for durability and corrosion resistance. Operating temperature ranges from -55°C to +125°C, ensuring high performance in demanding environments. Compliant with RoHS and lead-free, it offers multiple configurations, including single, double, and quad row options, suitable for high-density, miniature circuitry in industrial and consumer electronics.
Insulator Material: Black Liquid Crystal Polymer (LCP)
Terminal Material: Phosphor Bronze, 0.13 mm (0.005") thickness
Plating Options: Sn or Au over 50 μ" Ni
Operating Temperature Range: -55°C to +105°C with Tin, -55°C to +125°C with Gold
RoHS Compliant: Yes
Lead-Free: Yes
Pitch: 2.00 mm (0.0787")
Design: Modified through-hole header, multiple configurations available
Part Numbers: MTMM-<>-<>-<> (e.g., MTMM10504GD170)
Series: Non-standard, non-returnable, subject to change without notice
Buy the Samtec MTMM10504GD170 – Reliable Board-to-Board Connector for Industrial Applications
Upgrade your electronic designs with the high-quality Samtec board-to-board connector. Featuring gold or tin plating, it offers excellent conductivity, corrosion resistance, and temperature stability. Designed for demanding industrial and consumer applications, this connector supports various configurations to meet your specific needs. It is RoHS compliant and lead-free, ensuring safe and eco-friendly assembly. Easy to install and available for online purchase, this connector ensures reliable connections, durability, and optimal performance for your electronic systems.
Buy Samtec MTMM10504GD170 now and experience unmatched reliability and high-performance connectivity in your industrial projects.
Frequently Asked Questions
Where can I buy SAMTEC MTMM10504GD170?
You can click on the BUY or RFQ button to purchase MTMM10504GD170 from an authorized SAMTEC distributor.
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