The MTMM connector series features modified through-hole headers designed for versatile board mating options, including single, double, or quad row configurations. Made with black liquid crystal polymer insulators and phosphor bronze terminals, these connectors support RoHS compliance and are lead-free solderable. Operating within -55°C to +105°C with tin plating and up to +125°C with gold plating, they are suitable for high-reliability applications. Available in various sizes and pin configurations, these connectors are used in electronic systems requiring durable, SMD or thru-hole connections, ensuring optimal electrical performance and mechanical stability.
Operating Temperature Range: -55°C to +105°C with Tin, -55°C to +125°C with Gold Plating
RoHS Compliant: Yes
Lead-Free Solderable: Yes
Pitch: 2.00 mm (0.0787 inch)
Number of Positions: Various options available
Design: Modified through-hole header with single, double, or quad row options
Dimensions: Length varies, typically around 2.00 mm pitch, specific length depends on configuration
Design Features: Non-returnable series, built to strict specifications, subject to change without notice
Operational: Suitable for electronic, industrial, and automation applications requiring durable and reliable connections
Buy the Buy Samtec MTMM Part Number MTMM11303GD140 Online
Purchase the Samtec Modified Through-Hole Header today for reliable, high-quality board-to-board connections. Featuring liquid crystal polymer insulators and phosphor bronze contacts, these connectors are designed for high-temperature environments and RoHS compliance. Ideal for electronic, industrial, and automation systems, they ensure lasting performance with lead-free, solderable construction. Available in multiple configurations and sizes, their durable design guarantees mechanical stability and excellent electrical conductivity. Shop online now for fast, secure delivery of these versatile headers suited for demanding applications.
Get Samtec MTMM11303GD140 today—built for precision and long-lasting durability in electronic connection applications.
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