The MTMM series is a high-quality, modified through-hole header designed for versatile board mating solutions with options for single, double, or quad row configurations. Crafted with a black liquid crystal polymer insulator and phosphor bronze terminals, these headers feature tin or gold plating over nickel for enhanced durability and conductivity. Operating temperature ranges from -55°C to +125°C, making them suitable for demanding environments. Fully RoHS compliant and lead-free, these headers ensure reliable, sustainable connections across various industrial applications with customizable pin counts and spacing.
Operating Temp Range: -55°C to +125°C (Gold), -55°C to +105°C (Tin)
RoHS Compliant: Yes
Lead-Free Solderable: Yes
Pitch: 2.00 mm (.0787 inch)
Height options vary from 6.48 inch (165 mm) to 21.08 inch (536 mm)
Number of positions varies with model, up to 13 positions
Configuration: Single, double, or quad row
Design: Modified through-hole header for reliable board connections
Custom configurations available upon request (MOQ required)
Buy the Samtec Series MTMM Modified Through-Hole Header: MTMM13903GD118
Secure your industrial and electronic connections with the high-performance Samtec Through-Hole Header. Crafted with durable, RoHS-compliant materials, these headers feature customizable pin configurations and high-temperature resilience. Perfect for demanding applications requiring reliable, solderable connections. Whether for prototyping or mass production, expand your assembly options with these versatile headers. Easily integrate with your existing systems and ensure longevity and robust performance in various environmental conditions. Order online today and enjoy fast, hassle-free delivery of quality components.
Buy Samtec MTMM13903GD118 now and experience unmatched reliability and performance for your board-to-board connections.
Frequently Asked Questions
Where can I buy SAMTEC MTMM13903GD118?
You can click on the BUY or RFQ button to purchase MTMM13903GD118 from an authorized SAMTEC distributor.
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