The MTSW series are high-density, stackable board-to-board connectors with a flexible pitch of 2.54 mm (.100 inch) and customizable post heights. Made from black glass-filled polyester insulators, these connectors feature phosphor bronze terminals with gold or tin plating, supporting operating temperatures from -55°C to +125°C with gold plating. They offer various configurations including straight or right-angle versions, accommodate a range of post heights, and are RoHS compliant, ideal for modular and compact electronic systems requiring reliable interconnections.
Material: Black Glass-filled Polyester insulator, Phosphor Bronze terminals
Plating: 50 μ
Gold or Tin options
Operating Temperature: -55°C to +125°C with Gold, -55°C to +105°C with Tin
Pitch: 2.54 mm (.100 inch)
Post Heights: Specify in inches, increments of .005" (0.13 mm)
Current Rating: 3 A per circuit
Voltage Rating: 250 V AC/DC
RoHS Compliant: Yes
Configurations: Straight and right-angle versions, multiple post height options
Cable Compatibility: Suitable for various PCB and cable interconnects
Certifications: RoHS compliant, UL approved
Design Flexibility: Non-standard, non-returnable series with customizable post heights
Operating Temp Range: -55°C to +125°C with Gold, -55°C to +105°C with Tin
Buy the Samtec MTSW-126-23-L-S-237 Reliable Board-to-Board Connectors for Industrial Applications
Order the Samtec MTSW series stackable connectors online today and guarantee secure, reliable connections for your electronic assemblies. Designed for high-density applications, these connectors feature customizable post heights, gold or tin plating, and versatile configurations including straight or right-angle options. Constructed with durable materials, they support extensive temperature ranges from -55°C to +125°C, ensuring performance in demanding environments. Enhance your electronic systems' modularity and efficiency by purchasing now for quick, hassle-free delivery and expert support.
Buy Samtec MTSW-126-23-L-S-237 now and experience unmatched reliability and performance in high-density electronic interconnections.
Frequently Asked Questions
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