The MTSW10207LS200 is a versatile board and cable mate connector series designed for high flexibility and reliability in electronic assemblies. Featuring a black glass-filled polyester insulator with phosphor bronze contacts, the connector supports various post heights and optional gold or tin plating. Its temperature range spans from -55°C to +125°C. RoHS compliant and lead-free, it ensures durability and safety for demanding applications. Suitable for stacking and modular connections, it offers easy customization for diverse electronic and industrial needs. Ideal for compact systems requiring secure, reliable interconnections.
SAMTEC MTSW10207LS200 Board and Cable Connector Specifications:
Insulator Material: Black Glass Filled Polyester
Contact Material: Phosphor Bronze
Plating: Gold or Tin options
Operating Temperature Range: -55°C to +125°C with Gold, -55°C to +105°C with Tin
RoHS Compliant: Yes
Lead-Free Solderable: Yes
Post Height Specification: Customizable, specified in INCHES with .005" (0.13 mm) increments
Dimensions: Vary based on model, typically supporting multiple positions and configurations
Application: Modular, high-density electronics, stacking, and interconnection modules
Design: Non-standard, non-returnable series, subject to updates without notice
Buy the Samtec Series MTSW Board Cable Connector: MTSW10207LS200
Purchase the Samtec MTSW10207LS200 online today to enjoy reliable, flexible interconnect solutions ideal for high-performance electronic assemblies. Designed with modular stacking capabilities and customizable post heights, this connector series supports a wide temperature range from -55°C to +125°C, ensuring durability in demanding environments. Its RoHS compliance and lead-free construction make it suitable for eco-conscious manufacturing. Secure your electronic systems with this dependable connector—order now for quick delivery and seamless integration into your designs, ensuring efficiency and technical excellence.
Buy Samtec MTSW10207LS200 now and experience unmatched reliability and high-density modular interconnection performance.
Frequently Asked Questions
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