This flexible board connection system features high stacking flexibility with various configurations for pins, pitch, and heights. Made from durable materials like black glass-filled polyester insulators and phosphor bronze contacts with 50 micro-inch nickel plating, it operates within a temperature range of -55°C to +125°C with gold and -55°C to +105°C with tin. Suitable for high-density interconnections, it ensures reliable, solderable, and RoHS-compliant connections for electronic and industrial applications. Customizable post heights offer tailored solutions for complex board designs, with options for straight or right-angle configurations and polarization features.
Plating: 50 micro-inch Nickel with Gold or Tin options
Operating Temperature Range: -55°C to +125°C with Gold, -55°C to +105°C with Tin
RoHS Compliant: Yes
Lead-Free Solderable: Yes
Post Heights: Specify in inches, increments of 0.005" (0.13 mm)
Contact Pitch: 2.54 mm (0.100")
Versions: Straight and Right-Angle (RA) options
Post Material: Gold or Tin plated
Design: Non-standard, customizable post heights and polarization features
Application: Suitable for high-reliability electronic and industrial interconnects
Availability: Custom options include polarized posts and various pin configurations
Buy the Buy Samtec MTSW-10208SD290 Part Number MTSW10208SD290 Online
Discover the versatility and durability of our Board Connector, designed for high-density electronics with customizable post heights. Made from high-quality polyester insulators and phosphor bronze contacts, it ensures reliable, RoHS-compliant connections suitable for industrial and electronic applications. Featuring options for gold or tin plating, straight or right-angle configurations, and polarization, this connector offers flexible solutions for complex designs. Easy to solder, environmentally compliant, and built to exact specifications, it guarantees optimal performance and long-term reliability for your projects.
Buy Samtec MTSW-10208SD290 now and experience unmatched reliability and performance in high-density electronic connections.
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