The MTSW series comprises high-density stacking headers designed for versatile interconnections in electronic assemblies. Constructed with black glass-filled polyester insulators and phosphor bronze contact material, these headers feature gold and tin plating options for enhanced electrical performance. Available with various lead styles, including straight and right-angle configurations, they support multiple post heights for tailored applications. Operating within -55°C to +125°C temperature range, these RoHS-compliant connectors ensure durability, reliable contact integrity, and compatibility with lead-free soldering processes, making them ideal for compact, high-performance electronic systems.
Plating: Gold or Tin options, 50 microinches Ni underlayer
Operating Temp Range: -55°C to +125°C with Gold plating, -55°C to +105°C with Tin plating
RoHS Compliant: Yes
Lead Style: Straight and Right-Angle options, specify post height in 0.005 inch increments
Size Options: Post heights from 0.090 inches to 1.290 inches, various configurations
Suitable for lead-free soldering, compatible with RoHS standards
Non-standard, non-returnable series, subject to component changes without notice
Dimensions and post spacing: 2.54 mm (0.100 inches) pitch, customizable post height
Buy the Buy Samtec MTSW Series Stacking Headers Part Number MTSW10324SD280 Online
Purchase the Samtec MTSW10324SD280 stacking header online now to ensure high-quality interconnectivity in your electronic projects. Designed with durable materials and featuring customizable post heights, these headers provide reliable contact and excellent temperature performance from -55°C to +125°C. Constructed with RoHS-compliant, lead-free process support, they are suitable for a wide range of applications requiring compact, high-performance connections. Easy to install and adaptable to various configurations, these headers are essential for modern electronics requiring flexible and robust interconnect solutions.
Get Samtec MTSW10324SD280 stacking headers today—built for high-density electronic interconnections, durability, and tailored configurations.
Frequently Asked Questions
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