This is a high-density, compact board connector designed for versatile stacking applications in electronic assemblies. It features a durable polyester insulator, phosphor bronze contacts with gold or tin plating for reliable conductivity, and various lead styles and post heights to accommodate different design needs. The connector supports temperature ranges from -55°C to +125°C, complies with RoHS standards, and offers options for lead-free soldering. Its modular design allows customization for board-to-board connections with flexible pitch and configuration options, making it suitable for complex, multi-layered electronic systems.
Operating Temp Range: -55°C to +125°C with Gold, -55°C to +105°C with Tin
RoHS Compliant: Yes
Lead-Free Solderable: Yes
Post Height: Specify in inches with 0.005" increments
Current Rating: Suitable for high-density interconnects
Pitch Options: 0.100" (2.54 mm), 0.200" (5.08 mm), with customizable post lengths
Connector Style: Straight and Right-Angle versions available
Number of Positions: Varies based on configuration, up to 28 positions
Applications: Electronic systems, circuit boards, industrial automation, data communication
Additional features include polarized options and optional pre-tinned posts for ease of soldering
Buy the Buy Samtec MTSW10607TS000 High-Density Board Connector Part Number Online
Secure your electronic designs with the high-density board connector designed by Samtec, offering customizable stacking options, durable materials, and excellent temperature performance. Easy to solder with lead-free options, this connector supports complex multilayer systems. Its versatile configurations include straight and right-angle versions, ensuring optimal placement in your circuit. Whether for industrial automation, data communication, or complex circuitry, this connector ensures reliable, long-lasting connections. Purchase online now for fast delivery and superior quality to elevate your electronic projects.
Buy Samtec MTSW-126-23-L-S-237 now and experience unmatched reliability and high-density performance for your electronic assemblies.
Frequently Asked Questions
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