The MTSW series is a versatile multiple position connector designed for high-density board-to-board and cable-to-board applications. Constructed with black glass-filled polyester insulators and phosphor bronze contacts with gold or tin plating, these connectors support operating temperatures from -55°C to +125°C with gold plating and -55°C to +105°C with tin. They feature various post heights, polarization options, and angled or straight configurations, providing flexible stacking and mating options for space-constrained electronic assemblies. Suitable for RoHS-compliant environments, these connectors are engineered for durability, precise alignment, and reliable electrical performance in advanced electronic systems.
Operating Temp Range: -55°C to +125°C with Gold, -55°C to +105°C with Tin
RoHS Compliant: Yes
Post Height: Specify in inches, increments of 0.005"
Versions: Straight and Right-Angle (RA)
No. of Positions: Multiple, customizable stack height
Cable and Board Mounting: Compatible with 2.54 mm (0.100") pitch strips
Construction: Non-standard, non-returnable
Certifications: RoHS compliant
Design Flexibility: Support for various stacking heights and polarization options
Applications: PCB-to-PCB, cable-to-board connections in high-density electronic systems
Buy the Samtec Series MTSW Connectors: MTSW10624SS290
Order the Samtec MTSW10624SS290 connector today online and ensure your electronic assembly benefits from superior build quality, precise polarization, and customizable stack heights. Designed for high-density applications, this connector supports various mounting configurations, operating reliably over wide temperature ranges. With RoHS compliance and durable materials, it guarantees long-lasting performance in critical electronic systems. Purchasing online provides quick access to specifications, technical support, and fast delivery, helping you meet project deadlines and enhance your device’s connectivity quality efficiently.
Buy Samtec MTSW10624SS290 now and experience unmatched reliability and performance in high-density electronic interconnections.
Frequently Asked Questions
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