The MTSW series are stackable multielement connectors designed for high-density PCB applications, offering flexible lead styles, precise pitch options, and robust construction with glass-filled polyester insulators and phosphor bronze contacts. These connectors operate within -55°C to +125°C with gold plating and are RoHS compliant, ensuring reliability in demanding environments. Ideal for compact electronic systems, the series features various post heights, configurations, and polarization options to meet diverse technical needs, making them suitable for modern electronic and automation systems requiring durable, space-saving interconnect solutions.
Insulator Material: Glass-filled polyester with black or natural finish
Terminal Material: Phosphor Bronze with gold or tin plating
Operating Temperature Range: -55°C to +125°C with gold plating, -55°C to +105°C with tin
Plating: 50 μin (1.27 μm) gold or tin
RoHS Compliant: Yes
Lead-Free Solderable: Yes
Pitch Options: 2.54 mm (0.100 inch) and modified pitches
Post Heights: Specify in inches, increments of 0.005"
Contact Material: Phosphor Bronze
Dimensions: Various post heights and configurations available
Designed for stackable, high-density electronic applications
Reliable for use in automated manufacturing and compact circuit boards
Includes polarized and straight or right-angle options
Buy the Buy Samtec MTSW Series Part Number MTSW10712GS840 Online
Enhance your electronic assembly with the Samtec stackable connector. Designed for high-density PCB applications, it features flexible lead styles, gold plating, and robust construction. This reliable connector ensures optimal electrical performance and durability in demanding environments. Easily integrate into automation systems or compact electronic devices with various configurations and polarized options. Purchase the MTSW series online today for fast delivery, ensuring a seamless upgrade to your circuit integration and reliable interconnect solutions that stand the test of time.
Get Samtec MTSW10712GS840 today—built for high-density interconnects and precise PCB stacking.
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