The MTSW-108-08-LD-S-229-RA is a high-density, stackable board-to-board connector designed for flexible, reliable electronics applications. Made with black glass-filled polyester insulator material and phosphor bronze contacts with gold plating, it offers excellent electrical performance and mechanical stability. Suitable for applications requiring a compact footprint, it operates from -55°C to +125°C with gold plating, ensuring durability and corrosion resistance. The connector features a 2.54 mm pitch, various height options, and RoHS compliance. Ideal for automated manufacturing, it supports multiple lead styles and configurations, providing versatile interconnect solutions for electronic assemblies.
Terminal Material: Phosphor Bronze with Gold Plating
Plating: 50 µin (1.27 µm) Ni over Gold
Operating Temperature Range: -55°C to +125°C with Gold, -55°C to +105°C with Tin
RoHS Compliant: Yes
Lead-Free Solderable: Yes
Pitch: 2.54 mm
Post Height: Specify in inches in 0.005" (0.13 mm) increments
Versions: Straight and Right-Angle options available
Maximum No. of Positions: Varies per configuration
Dimensions: Length and height vary based on configuration, typical post height up to several inches
Compatibility: Various lead styles, including TSW, SSW, and custom options
Certifications: RoHS, UL Listed (if applicable)
Buy the Buy Samtec MTSW10808LD Part Number MTSW10808LD040 Online
Secure your Samtec MTSW10808LD board-to-board connector online today and benefit from fast delivery, competitive pricing, and expert support. Designed for high-density applications, this connector features a 2.54 mm pitch, gold-plated contacts, and versatile configurations. Its black glass-filled polyester insulator ensures durability while supporting operation from -55°C to +125°C. Whether for automated manufacturing or custom electronic assemblies, purchasing online guarantees you high-quality, RoHS-compliant interconnect solutions with reliable performance tailored to your needs.
Order your Samtec Series MTSW10808LD connector today and ensure reliable, high-density interconnects for your electronic projects.
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