The MTSW10808TS007 is a high-density stacking connector designed for flexible PCB configurations. It features a black glass filled polyester insulator, phosphor bronze contacts with gold plating, and operates within a temperature range of -55°C to +125°C with gold or -55°C to +105°C with tin plating. Suitable for board-to-board applications, it offers multiple lead styles, post heights, and configurations including straight and right-angle versions. This connector ensures reliable electrical connections with RoHS compliance and robust construction for demanding electronic systems.
Plating: 50 µin (1.27 µm) Gold on contacts, Ni on other surfaces
Operating Temp Range: -55°C to +125°C with Gold, -55°C to +105°C with Tin
RoHS Compliant: Yes
Lead-Free Solderable: Yes
Post Height: Specify in inches, increments of 0.005" (0.13 mm), typical heights vary
Connector Style: Straight and right-angle versions available
Number of Positions: Varies per configuration, example includes 8 positions
Dimensions: Varies with options, typical length around 0.600 inch (15.24 mm)
Design: Non-standard, non-returnable series, customizable post heights
Application: Ideal for compact, high-density PCB stacking in electronic systems
Buy the Buy Samtec MTSW10808TS007 Part Number MTSW10808TS007 Online
Enhance your electronic development with the Samtec MTSW10808TS007 high-density stacking connector. Designed for demanding PCB configurations, it features gold-plated contacts for excellent conductivity, robust insulation made from black glass-filled polyester, and offers versatile configurations including straight and right-angle options. This connector ensures reliable, solderable connections with RoHS compliance, operating efficiently across -55°C to +125°C. Ideal for space-constrained designs, its customizable post heights and multiple configurations support flexible assembly and long-term durability for diverse industrial, automation, or consumer electronics projects.
Buy Samtec MTSW10808TS007 now and experience unmatched reliability and performance in high-density PCB stacking applications.
Frequently Asked Questions
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