The MTSW10809LS500 is a high-performance, stackable interconnect featuring a black glass filled polyester insulator and phosphor bronze contacts with 50 microinch gold plating. Designed for versatile PCB applications, it offers a temperature range from -55°C to +125°C with gold or -55°C to +105°C with tin, and RoHS compliance. The connector's dimensions support various post heights in 0.005-inch increments, providing adaptable stacking solutions for complex electronic assemblies. Its robust construction ensures reliable electrical performance and long-term durability in demanding environments.
Terminal Material: Phosphor bronze with 50 microinch gold plating
Operating Temperature Range: -55°C to +125°C with Gold, -55°C to +105°C with Tin
RoHS Compliance: Yes
Post Height: Specify in 0.005-inch increments in dimensions from 0.254 inches upward
Plating: Gold over nickel, optional tin
Current Rating: Dependent on application, typically suitable for signal and low-power electronics
Mounting Style: Board-mount, stackable connector
Version Compatibility: Straight and right-angle versions available, with optional polarization
Design Flexibility: Custom post heights, various pin configurations, robust construction for reliable connections
Connector Type: Multi-positional stacking connector suitable for complex industrial and electronic systems
Buy the Samtec Series MTSW Stackable Interconnect: MTSW10809LS500
Discover the advanced performance and flexibility of the Samtec Stackable Interconnect. Engineered for reliable board-to-board connections, it features customizable post heights, gold or tin plating, and a durable polyester insulator. Ideal for complex electronic assemblies requiring precise connectivity and robust durability. Purchase online today and ensure your project benefits from high-quality, industry-approved interconnect solutions that meet diverse technical specifications and enhance your electronic system’s reliability and performance.
Buy Samtec MTSW10809LS500 now and experience unmatched reliability and performance in stacking interconnect solutions.
Frequently Asked Questions
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