The MTSW series offers high flexibility with a wide range of stackable interconnect solutions designed for custom heights and configurations. Made from black glass-filled polyester insulators with phosphor bronze contact material, these modules feature gold or tin plating for excellent conductivity and corrosion resistance. Operating within temperatures from -55°C to +125°C for gold-plated versions, they comply with RoHS standards and support lead-free soldering. Suitable for high-density, space-saving applications, they are vital components in electronic and industrial equipment requiring reliable board-to-board connections with various post heights and angles.
Operating Temp Range: -55°C to +125°C (Gold) / -55°C to +105°C (Tin)
RoHS Compliant: Yes, Lead-Free Solderable
Dimensions: Post heights specified in inches, increments of 0.005" (0.13mm), with standard options up to 1.29 inches
Features: Multiple configurations including straight and right-angle versions, customizable post heights, polarized options, and various sizes
Usage: Suitable for high-density electronic equipment, industrial automation, and control systems requiring reliable interconnects
Construction: Durable, RoHS compliant, designed for multiple insertion cycles, supports industry-standard pitches of 0.100" and 0.200"
Buy the Samtec Series MTSW Interconnect: MTSW11009GD520LL
Purchase the Samtec MTSW interconnect module online today and enjoy seamless high-density connectivity for your electronic projects. Designed with flexible post heights and plated contacts, this module ensures dependable connections in industrial and electronic environments. Its durable construction and customizable configurations support various assembly needs, offering excellent electrical performance and long-term reliability. Shop now to enhance your system’s stability and efficiency with this industry-leading interconnect solution, perfectly suited for space-constrained and high-performance applications.
Buy Samtec MTSW11009GD520LL now and experience unmatched reliability and performance in your high-density interconnection applications.
Frequently Asked Questions
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