This high-density Micro Terminal Strip Wire-to-Board connector offers excellent stacking flexibility with various pin counts and orientations. Constructed from black glass-filled polyester insulator material with gold-plated phosphor bronze contacts, it ensures reliable electrical connections and durability. Suitable for temperatures ranging from -55°C to +125°C with gold plating or -55°C to +105°C with tin plating, it complies with RoHS standards. Available in different post heights and orientations, these connectors are ideal for compact, high-performance electronic assemblies, providing versatility in many industrial and electronic applications.
Plating: 50 µinch (1.27 µm) Nickel with Gold or Tin
Operating Temp Range: -55°C to +125°C with Gold, -55°C to +105°C with Tin
RoHS Compliant: Yes
Post Heights: Specify in 0.005 inch (0.13 mm) increments
Post Styles: Straight and Right-Angle (RA)
Number of Positions: Varies with configuration, e.g., 9, 13, 23, 27, 28, 29
Voltage Rating: Suitable for high-density interconnects
Dimensions: Length varies depending on configuration, typical post height ranges from 0.250 inch to 1.000 inch
Lead-Free Solderable: Yes
Series: MTSW
Temperature Rating: -55°C to +125°C (Gold), -55°C to +105°C (Tin)
Buy the Buy Samtec MTSW11011GS680 Part Number MTSW11011GS680 Online
Discover the reliable high-density Micro Terminal Strip connector from Samtec. Featuring gold or tin plating, various post heights, and dual orientations, it ensures optimal electrical performance in compact electronic assemblies. With a temperature range from -55°C to +125°C, it suits demanding industrial environments. Built with durable materials such as black glass-filled polyester and phosphor bronze contacts, this series is RoHS compliant and designed for easy soldering and installation. Perfect for high-performance applications requiring compact, versatile, and robust interconnect solutions, buy online today for quality you can trust.
Get Samtec MTSW11011GS680 today—built for high-density connections, reliability, and durability in electronic assemblies.
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