The MTSW series are high-density, low-profile board-to-board connectors designed for flexible stacking in electronic systems. Made with black glass-filled polyester insulators and phosphor bronze contacts with gold plating, these connectors support a wide operating temperature range of -55°C to +125°C with gold and -55°C to +105°C with tin. They offer customizable post heights and various configurations, including straight and right-angle options, ensuring versatile application in compact electronic assemblies. Compliant with RoHS, these connectors are ideal for demanding electrical and industrial environments, providing reliable connectivity with robust mechanical and electrical performance.
Operating Temperature Range: -55°C to +125°C with Gold, -55°C to +105°C with Tin
RoHS Compliance: Yes
Configuration: Straight and Right-Angle Versions Available
Post Height: Specify in inches with 0.005" (0.13 mm) increments
Current Rating: Not specified, suitable for typical low-voltage, high-density applications
Connection Type: Board-to-Board, Stackable
Dimensions: Vary by configuration, with dimensions specified per model
Non-standard, non-returnable series due to ongoing design evolution
Effective for high-density electronic modules requiring reliable stack connections
Buy the Buy Samtec MTSW Series Connector Part Number MTSW11209GD465 Online
Purchase the Samtec MTSW series connector online today to benefit from high-density board-to-board connections with customizable post heights, gold or tin plating, and versatile configurations. Designed for demanding electronic systems, these connectors offer robust electrical performance, wide operating temperature ranges, and compliance with RoHS standards. Whether you need straight or right-angle versions, ordering online ensures prompt delivery to keep your project on schedule. Reliable, compact, and versatile, the MTSW series connectors are your ideal choice for advanced electronic connectivity solutions.
Order your Samtec MTSW11209GD465 series connector today and ensure your electronic assemblies have reliable, high-density stacking capabilities.
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