The MTSW series are high-density, stackable board-to-board connectors with a flexible configuration, ideal for electronic applications requiring compact, reliable interconnections. Made from black glass-filled polyester insulator material with phosphor bronze contacts, these connectors support a wide temperature range from -55°C to +125°C with gold plating and operate at RoHS compliance standards. They offer various post heights and configurations, including straight and right-angle versions, suitable for versatile mounting options in electronic assemblies, ensuring durability and minimal space usage.
Plating: 50 Micro inches Gold, Nickel Option available
Operating Temp Range: -55°C to +125°C with Gold plating, -55°C to +105°C with Tin plating
RoHS Compliant: Yes
Mounting Styles: Straight and Right-angle (RA) options
Post Heights: Multiple options specified in inches, increments of 0.005"
Dimensions: Post height varies, with typical lengths around 0.25 inches (6.35mm) to over 1 inch (25.4mm)
Contact Plating: Gold on post, optional other platings, consult manufacturer
Electrical: Support for high-density connection, detailed specifications vary by configuration
Mechanical: Designed for reliable stackability and multi-position flexibility
Temperature Range: -55°C to +125°C
Buy the Buy Samtec Stackable Connectors Part Number MTSW11312SD800 Online
Purchase the Samtec MTSW11312SD800 stackable connector online to ensure reliable, space-efficient interconnections for your electronic projects. Designed for durability and versatility, this connector features multiple post heights and mounting styles, including straight and right-angle options. Made from high-quality insulator and contact materials with gold plating, it supports a wide temperature range for various applications. Easily integrate this high-density connector into your designs to improve performance, streamline assembly, and achieve excellent electrical contact reliability, all delivered swiftly online.
Buy Samtec MTSW11312SD800 now and experience unmatched reliability and high-density interconnection performance.
Frequently Asked Questions
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