The MTSW11409GS485 is a versatile stackable connector offering high flexibility in PCB and cable assembly. Designed with a durable black glass filled polyester insulator and phosphor bronze contacts plated with gold, it provides reliable electrical connections for industrial applications. Operating within a temperature range of -55°C to +125°C with gold plating ensures longevity and consistent performance. Suitable for custom stack heights and configurations, this connector meets RoHS standards and is ideal for use in various electronic, automation, and manufacturing environments, ensuring robust and flexible interconnection solutions.
Plating: Gold (Au) on contacts, 50 µin (1.27 µm) thickness
Operating Temp Range: -55°C to +125°C with gold plating, -55°C to +105°C with tin plating
RoHS Compliant: Yes
Lead-Free Solderable: Yes
Dimensions: Customizable post height in 0.005 inch (0.13 mm) increments, standard lengths vary by model
Mounting Style: Straight and Right-Angle options available
Compatible with standard PCB hole sizes and connector types
Application: PCB-to-board, cable-to-board connections in industrial, automation, and electronic systems
Buy the Samtec MTSW11409GS485 – Reliable Stackable Connectors for Industrial Applications
Purchase the Samtec MTSW11409GS485 online today to ensure reliable and flexible interconnection in your electronic and industrial systems. Designed with high-quality materials, gold-plated contacts, and customizable heights, this connector offers excellent performance across a wide temperature range. Perfect for PCB and cable assembly, it meets RoHS standards and provides robust, long-lasting connections. Ease your assembly process and improve system reliability by ordering online—secure fast shipping and trusted quality for your engineering needs.
Get Samtec MTSW11409GS485 today—built for precision and long-lasting durability in demanding environments.
Frequently Asked Questions
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You can click on the BUY or RFQ button to purchase MTSW11409GS485 from an authorized SAMTEC distributor.
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