The MTSW11411GS677 is a high-density stacking connector designed for flexible board-to-board connections. It features a black glass filled polyester insulator and phosphor bronze terminals with gold plating for enhanced conductivity and corrosion resistance. Suitable for operating temperatures from -55°C to +125°C, this connector supports various post heights and configurations, including straight and right-angle versions with polarized options. Compliant with ROHS standards, it ensures reliable electrical connections in demanding electronic assemblies and offers excellent stacking flexibility for complex interconnection needs.
Operating Temperature Range: -55°C to +125°C (with Gold), -55°C to +105°C (with Tin)
RoHS Compliant: Yes
Post Height: Specify in inches, increment of 0.005"
Versions: Straight and Right-Angle options with polarized configuration
Post Material: Gold on post (other platings available)
Lead-Free Solderable: Yes, suitable for wave soldering
Number of Positions: Varies, including 19, 21, 23, 24, 27, and others
Certifications: RoHS compliant
Overall Lengths: Ranges from approximately 0.90 inches to over 1.39 inches depending on configuration
Design: High stacking flexibility, non-returnable series due to continuous product improvements
Compatibility: Board-mate and cable-mate options for versatile interconnection
Buy the Samtec Series MTSW High-Density Stacking Connector: MTSW11411GS677
Invest in the Samtec Stackable Connector designed for high-density electronic applications. Featuring durable gold-plated contacts, versatile configurations, and a wide temperature range, this connector ensures stable, high-performance interconnections. Ideal for complex electronic systems requiring precise spacing, it offers straightforward installation and RoHS compliance. Purchase online now to guarantee quality and reliability in your projects with fast delivery and excellent support from trusted electronics suppliers.
Order your Samtec Series MTSW11411GS677 stacking connector today and enhance your electronic assemblies with reliable high-density interconnections.
Frequently Asked Questions
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