The MTSW-115-09-L-S-229-RE is a high-density stacking connector designed for versatile applications in electronics. Made with black glass-filled polyester insulators and phosphor bronze contacts with gold plating, it offers excellent electrical conductivity and durability. Operating within a temperature range of -55°C to +125°C with gold plating and -55°C to +105°C with tin, it complies with ROHS standards. Featuring customizable post heights and compatibility with standard and right-angle configurations, this connector ensures reliable connections in complex circuit assemblies. Suitable for applications requiring flexible stacking and high-performance signal transfer.
Operating Temp Range: -55°C to +125°C with Gold, -55°C to +105°C with Tin
RoHS Compliant: Yes
Post Height: Specify in inches, increments of 0.005"
Dimensions: Varying based on configuration, approximately 0.090" (2.29mm) OAL for standard version
Lead-Free Solderable: Yes
Versions Available: Straight and Right-Angle options
Number of Posts: 2 to 23 posts
Pin Diameter: 0.025" (0.64mm)
Contact Resistance: Low, suitable for high-speed signals
Mechanical Durability: Designed for repeated mating cycles
Compliance: ROHS, UL Recognized
Buy the Buy Samtec High-Density Stacking Connector Part Number MTSW-115-09-L-S-229-RE Online
Purchase the Samtec stacking connector MTSW-115-09-L-S-229-RE online today to enjoy seamless connectivity options, flexible configurations, and durable, high-quality performance. Designed for demanding electronic applications, this connector features customizable post heights, gold-plated contacts, and robust insulator materials ensuring long-lasting reliability. Ideal for stacking multiple circuit boards or modules, it simplifies assembly while maintaining secure connections. Take advantage of fast shipping and expert support to enhance your electronic projects and ensure optimal circuit performance with this versatile, industry-standard connector.
Buy Samtec MTSW-115-09-L-S-229-RE now and experience unmatched reliability and high-performance signal transfer in complex electronic assemblies.
Frequently Asked Questions
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