The MTSW series provides flexible, high-density board-to-board connectors with various stack and header options. Features include black glass-filled polyester insulators, phosphor bronze contacts with gold or tin plating, operating temperature ranges from -55°C to +125°C or +105°C depending on plating, and RoHS compliance. These connectors support different post heights, standards, and orientations, making them ideal for compact electronic assemblies requiring reliable electrical connections with customizable configurations. Suitable for applications demanding high performance, durability, and flexibility in industrial and electronic systems.
Plating: 50 μin (1.27 μm) Nickel with optional Gold or Tin
Operating Temp Range: -55°C to +125°C with Gold, -55°C to +105°C with Tin
RoHS Compliant: Yes
Lead-Free Solderable: Yes
Post Height: Specify in inches with 0.005" (0.13 mm) increments
Post Style: Straight or Right-Angle (RA) options
Number of Positions: Varied, e.g., 9, 10, 12, 14, 22, etc.
Contact Material: Phosphor Bronze
Connection Type: Board-to-board, stackable
Temperature Range: -55°C to +125°C or +105°C depending on plating.
Compliance: RoHS
Version Types: Standard, with RA options, various post heights
Compatibility: Pogo Pin, Test Point, Custom configurations available
Buy the Samtec MTSW11521GD1200 – Reliable Board-to-Board Connectors for Industrial Applications
Purchase Samtec MTSW11521GD1200 online to ensure your electronic projects benefit from high-quality, customizable board-to-board connectors. These connectors feature flexible configurations, high-temperature operation, and RoHS compliance, making them suitable for a wide range of industrial applications. With options for different post heights, contact plating, and orientations, you can tailor your connection solutions precisely. Buying online guarantees quick delivery, competitive pricing, and easy access to technical specifications, ensuring your assembly process remains efficient and reliable.
Buy Samtec MTSW11521GD1200 now and experience unmatched reliability and performance in compact electronic systems.
Frequently Asked Questions
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